Thermal Gap Pads

Offering a wide range of thermal conductivity from 1.5 to 14+ W/m·K, these pads feature high softness, low stress, and excellent resilience. They effectively fill micro-voids between heat-generating components and heat sinks to minimize interfacial thermal resistance. The entire series features D3~D20 non-detectable high purity , making them ideal for AI servers, laptops, and networking equipment to ensure long-term, stable thermal performance.

Thermal Gels

Utilizing a 100% siloxane-free specialty resin formulation, these pads eliminate the risks of contact failure or optical contamination caused by silicone oil volatilization and migration from the source. They are tailor-made for optical sensors, high-precision electronic components, and application environments that are extremely sensitive to outgassing.

Thermal EMI Absorbers

Combining superior thermal conductivity with electromagnetic interference (EMI) suppression characteristics, these materials solve the dual challenges of heat dissipation and EMI in high-frequency computing with a single solution. Widely used in SoC shielding, antenna modules, WiFi 6/6E, and 5G communication equipment, showcasing VOT's cutting-edge integration technology in the Thermal × EMI field.

Phase Change Materials

Solid at room temperature for easy die-cutting and rapid production line installation. When the device reaches its operating temperature, the material softens (phase changes) and exhibits high wettability to achieve an ultra-thin bond line thickness (BLT). It delivers ultra-low thermal resistance comparable to thermal grease while eliminating the pump-out failure risks associated with traditional silicone pastes.

Thermal Double-Sided Tapes

Combining high-strength adhesion with excellent thermal conductivity, these tapes tightly bond heat-generating components to heat sinks without the need for additional mechanical fasteners like screws or clips. This significantly simplifies the assembly process and saves space, making them widely used in LED display modules, backlight systems, and consumer electronics.

Non-Silicone Thermal Pads

Utilizing a 100% siloxane-free specialty resin formulation, these pads eliminate the risks of contact failure or optical contamination caused by silicone oil volatilization and migration from the source. They are tailor-made for optical sensors, high-precision electronic components, and application environments that are extremely sensitive to outgassing.