TW EN CN

R&D technology

R&D VISION

At VOT, R&D is defined by our "Mastery of the Microscopic World." We go beyond traditional compounding to engineer the physics of polymer chains and nano-fillers.
Through our proprietary "Triple-Lock Technology" and "Micro-Structure Re-engineering," we proactively design rheology and thermal paths at the molecular level, defying the physical trade-off between high conductivity and low hardness. We turn laboratory breakthroughs into stable mass production, ensuring that from precision optics to rugged industrial systems, every application benefits from our "molecular-level" thermal protection.

R&D PLATFORM & CAPABILITY MAP

MATERIAL DESIGN

MATERIAL DESIGN

Source-Lock Technology:                                                     Precise control of molecular weight for D3~D20 < 50ppm.
Extreme Thermal Formula:                                                   Multi-modal filler mixing for high W/m·K & low hardness.
Interface Engineering:                                                           Optimized filler-resin bonding to minimize thermal resistance.
Optical-Grade Purity:                                                             Preventing volatile contamination on lenses or contacts.
Micro-Structure Optimization:                                             Ensuring uniform heat flow paths and batch consistency.

→ Goal: To build a material foundation with high thermal performance and zero long-term outgassing.

PROCESS DEVELOPMENT

Low-Temp High-Shear Mixing:                                           Preventing pre-curing to unleash full material potential.
Precision Curing Control:                                                     Locking polymer structures for anti-aging properties.
Ultra-Thin Calendering:                                                         Achieving low BLT for compact space thermal management.
Flexible Mass Production:                                                     Supporting converting from rolls to custom die-cut parts.
Full-Form Process:                                                                 Production lines for Pads, Gels, PCM, and Absorbers.
→ Goal: Ensuring consistency, stability, and mass production capability across all material forms.

PROCESS DEVELOPMENT
TESTING & VALIDATION

TESTING & VALIDATION

Global Standard Testing:                                                       ISO22007-2 verified thermal conductivity .
Rheological Analysis:                                                           Predicting deformation and gap-filling under stress.
Lifespan Prediction:                                                               Simulating long-term thermal cycling to prevent Pump-out.
Automotive Grade Validation:                                             Rigorous environmental testing for EV/Industrial use.
1000hr+ Reliability:                                                               Passing 85/85 (Temp/Humidity) aging tests.
→ Goal: Validating material performance and long-term reliability via international standards.

CUSTOMER INTEGRATION

Co-Design (JDM):                                                                           Engaging from the ID stage to suggest optimal thermal paths.
Tolerance Analysis:                                                                     Calculating optimal compression to balance cooling & stress.
Rapid Sampling:                                                                         Providing engineering samples within 24-48 hours.
ODM Formulation:                                                                     Customizing viscosity, hardness, or absorption parameters.
System-Level Simulation:                                                           Evaluating device-level cooling to reduce tooling risks.
→ Goal: Helping clients complete Design-In faster and more accurately.

CUSTOMER INTEGRATION
TECHNOLOGY FOUNDATION

TECHNOLOGY FOUNDATION

A.    ZERO-VOLATILE SILICONE DESIGN

Strict Compliance: All series comply with D3~D20 non-detectable standards.
Exclusive Polymerization: Blocking siloxane volatile paths at the molecular source.
Zero Contamination: Ideal for optical lenses, precision contacts, and sealed modules.
Risk Elimination: Effectively prevents fogging and contact failures caused by siloxane migration.
→ Surpassing standard "low-volatile" products; VOT delivers truly "Zero-Volatile" purity.

TECHNOLOGY FOUNDATION

B.  MICRO-STRUCTURE ENGINEERING

High-Fill Compounding: Breaking limits to achieve >14 W/m·K with low hardness.
Micro-Alignment: Optimizing thermal paths to reduce resistance and boost heat flow.
Anti-Pump-Out: Blocking volatile paths to eliminate pump-out and dry-out failures.
Universal Application: Designed for high-frequency transmission, advanced computing, and high-power modules.

TECHNOLOGY FOUNDATION

EQUIPMENT

"Data is the cornerstone of quality. VOT has built a high-specification R&D laboratory aligned with international standards. From precise thermal conductivity measurement (ASTM D5470, ISO 22007-2) to micro-component analysis (GC-MS/FTIR) and rigorous environmental reliability testing, we validate not just 'initial performance' but ensure 'long-term stability,' building a solid defense for your brand's reputation."

ASTM D5470 Based TIM Tester

ASTM D5470 Based TIM Tester

ISO 22007-2 Based TIM Tester

ISO 22007-2 Based TIM Tester

ED-XRF Spectrometer

ED-XRF Spectrometer

GC Spectrometer

GC Spectrometer

Vector Network Analyzer

Vector Network Analyzer

Differential Scanning Calorimeter

Differential Scanning Calorimeter

Laser Particle Size Analyzer

Laser Particle Size Analyzer

Hardness Measurement

Hardness Measurement

High-Power Microscope

High-Power Microscope

Digital Viscometer

Digital Viscometer

Dispenser Tester

Dispenser Tester

Dielectric Constant Analyzer

Dielectric Constant Analyzer

Volume Resistivity Analyzer

Volume Resistivity Analyzer

Compression Tester

Compression Tester

Moving Die Rheometer

Moving Die Rheometer

UL 94 Flammability Tester

UL 94 Flammability Tester

Density Meter

Density Meter

Vision Measuring Machine

Vision Measuring Machine

Hipot Tester

Hipot Tester

Blade Coating Machine

Blade Coating Machine

BDV Analyzer

BDV Analyzer

Aging Chamber

Aging Chamber

HAST Chamber

HAST Chamber

Temperature Cycling Chamber

Temperature Cycling Chamber

R&D AND FEATURE TESTING

測試類別 (TEST CATEGORY) 測試項目 (TEST ITEM) 標準依據/測試方法 (TEST METHOD)
熱性能測試
(THERMAL PERFORMANCE TEST)
導熱阻抗值 (THERMAL IMPEDANCE) ASTM D5470
導熱係數 (THERMAL CONDUCTIVITY) ISO22007-2 OR ASTM D5470
熱膨脹係數 (COEFFICIENT OF THERMAL EXPANSION, CTE) ASTM E228
玻璃轉移溫度 (GLASS TRANSITION TEMPERATURE, TG) ASTM D3418
比熱容 (SPECIFIC HEAT CAPACITY, C) ASTM E1269
物性測試
(PHYSICAL PERFORMANCE TEST)
比重 (SPECIFIC GRAVITY) ASTM D792
邵氏硬度 (SHORE AND ASKER C HARDNESS) ASTM D2240 / JIS K 7312
壓縮性 (COMPRESSIBILITY DEFORMATION) ASTM D695
總質量損失 (TOTAL MASS LOSS, TML) BY VOT
低分子矽氧烷 (LOW MOLECULAR SILOXANE) 氣相層析分析儀 (GAS CHROMATOGRAPHY)
黏度 (VISCOSITY) ISO 3219
EMI減衰能力 (EMI ATTENUATION) ASTM D4935
耐燃等級 (UL FLAMMABILITY CLASS) UL94
電性測試
(ELECTRICAL PERFORMANCE TEST)
擊穿電壓 (DIELECTRIC BREAKDOWN) ASTM D149
表面與體積電阻 (SURFACE AND VOLUME RESISTIVITY) ASTM D257
介電常數與損耗因子 (DIELECTRIC CONSTANT AND FACTOR) ASTM D150
可靠度測試
(RELIABILITY TEST)
高溫高濕 (TEMPERATURE WITH HUMIDITY) JESD22-A110-B
冷熱衝擊 (THERMAL SHOCK) JESD22-A104-C
高溫 (HIGH TEMPERATURE) JESD22-A103
其他測試
(OTHER TEST)
熱重分析 (TGA) 熱重分析儀 (TGA)
材料熱穩定性與組成分析
(THERMAL STABILITY AND COMPOSITION ANALYSIS)
熱示差掃描分析儀 (DSC)

RELIABILITY TESTING

測試項目 (CODE) 測試條件 (CONDITION) 測試方法 (METHOD)
常溫測試
(CONTROL SAMPLE)
"TEMP.(°C) 25 ±2°C
TIME(HR): 250, 500, 750, 1000"
THERMAL RESISTANCE - ASTM D5470
THERMAL RESISTANCE - ASTM E1461
THERMAL CONDUCTIVITY - ISO 22007-2
熱高溫測試
(HIGH TEMPERATURE)
"TEMP.(°C) 125 ±2°C
TIME(HR): 250, 500, 750, 1000"
高溫高濕測試
(TEMPERATURE WITH HUMIDITY)
"TEMP.(°C) 85 ±2°C / 85 ±2% RH
TIME(HR): 250, 500, 750, 1000"
冷熱衝擊測試
(THERMAL SHOCK)
"TEMP.(°C) -40 ~ 120°C
CYCLE: 250, 500, 750, 1000
EVERY CYCLE : 40MINS"