R&D VISION
Shenghong Materials Technology boasts a highly qualified R&D team, many of whom hail from leading universities and research institutions. Our team specializes in the research and development of thermally conductive materials, heat dissipation solutions, and electromagnetic interference (EMI) shielding technologies. Our R&D center is equipped with advanced laboratory equipment and testing instruments, enabling us to conduct a wide range of specialized tests, including material performance analysis, thermal simulation testing, and electromagnetic compatibility assessments.
In the field of thermally conductive materials, we have developed a variety of high-performance thermal adhesives, phase change materials (PCMs), and graphite heat sinks, with thermal conductivity coefficients up to 15 W/m·K, suitable for the cooling needs of various electronic devices. Our ultra-thin heat dissipation films, featuring a unique microchannel design and a thickness of only 0.5 mm, offer excellent heat dissipation performance and have been successfully implemented in high-end laptops and smartphones.
In terms of EMI shielding technology, our conductive fabrics, conductive foams, and metal mesh products effectively suppress EMI in the 20 MHz to 6 GHz frequency band, achieving shielding effectiveness of up to 80 dB. We continuously invest in the research and development of new materials and maintain close collaborations with domestic and international academic institutions to ensure our technology remains at the forefront of the industry.
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