TW EN CN

Products

VK-X14S

Ultra-High Conductivity and Low-Stress Premium Thermal Pad
VK-X14S is designed from the TDS specification for reliable thermal management. Leads its class in performance while improving production convenience, interface conformity, and system service life.

Thermal Conductivity: 14.0 W/m-K (Hot Disk / ISO 22007-2)
Hardness: Shore OO 35, soft and low-stress with stable structure
Material Type: Ceramic-filled silicone high-conductivity structurally stable putty-like thermal pad
Core Advantage: Leads its class in performance while improving production convenience, interface conformity, and system service life.

Download Documents
Detailed Introduction

Performance Positioning and Thermal Value:
VK-X14S is built around 14.0 W/m-K (Hot Disk / ISO 22007-2) thermal performance together with Shore OO 35, soft and low-stress with stable structure. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Structurally Stable Putty-Like Technology:
The proprietary structural matrix gives the highly filled material putty-like wet-out and gap-filling behavior under compression while preserving pad cohesion, liner release, and die-cut processability. It reduces the tearing or sticky handling often seen in ultra-soft high-conductivity materials.
Recommended Applications: 
VK-X14S is suitable for Advanced AI packaging, optical modules and transceivers, networking equipment, high-density power devices, ADAS, and premium notebooks. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.