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VK-X14S

Ultra-High Thermal Conductivity & Low Stress Pad
Setting the benchmark for ceramic-filled thermal pads, the VK-X14S breaks the limitation of "high conductivity equals high hardness." Its extreme softness perfectly resolves stress and tolerance issues during high-end chip assembly.

Thermal Conductivity: 14 W/m·K (ISO 22007-2)
Hardness: Shore OO 35 (Ultra-soft)
Material Type: Ceramic-filled silicone thermal pad
Key Advantage: Outperforms equivalent imported brands, significantly enhancing mass production convenience and device lifespan.

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Detailed Introduction

Breakthrough Ultra-High Thermal Performance:
Utilizing VOT's proprietary multi-modal particle size compounding technology, the VK-X14S delivers industry-leading thermal performance （14 W/m·K @ ISO 22007-2） among ceramic-filled thermal pads. It rapidly transfers heat from heat-generating components to cooling modules, specifically engineered to solve the extreme thermal management challenges of high-computing-power devices.

Revolutionary Ultra-Soft and Low-Stress Design:
Breaking the technical bottleneck where high thermal conductivity materials are typically rigid, the VK-X14S boasts superior softness (only Shore OO 35) compared to equivalent imported brands. This characteristic provides the material with excellent compressibility and conformability, significantly reducing mechanical stress on precision electronic components during assembly while enhancing production line convenience and overall yield.
The Ultimate Thermal Partner for High-Computing Applications: 
Leveraging the dual advantages of ultra-high thermal conductivity and low stress, the VK-X14S is perfectly suited for high-end applications highly sensitive to heat and physical stress. Ideal for AI servers (CPU/GPU/HBM cooling) , ADAS control units , optical communication devices , and high-end notebooks, ensuring long-term stable performance under extreme computational loads.