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VK-X3S

3.2W Flagship Low-Stress Thermal Pad with High Integrity
VK-X3S is designed from the TDS specification for reliable thermal management. Uses a cross-linked matrix to overcome the tradeoff between ultra-softness and handleability, combining cohesive strength, conformity, and clean rework.

Thermal Conductivity：3.2 W/m-K (HOT DISK)
Hardness / Compression：Shore OO 20, ultra-low compression stress with clean handling
Material Type：ceramic-filled ultra-soft silicone thermal pad
Core Advantage：Uses a cross-linked matrix to overcome the tradeoff between ultra-softness and handleability, combining cohesive strength, conformity, and clean rework.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X3S is built around 3.2 W/m-K (HOT DISK) thermal performance together with Shore OO 20, ultra-low compression stress with clean handling. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Assembly-Friendly Mechanical Stability
The ceramic-filled silicone base provides reliable elastic recovery, surface wet-out, and handling strength. It maintains pad integrity during manual or automated placement and removes cleanly during service or rework to support production yield.

Recommended Application Scenarios
VK-X3S is suitable for Thin-profile displays, portable medical devices, fragile BGAs, bare-die components, thin PCBs, and automotive or portable shock-damping structures. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.