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VK-X8

9W Ultra-Conformable Thermal Pad for High-Density Electronics
VK-X8 is designed from the TDS specification for reliable thermal management. Shows putty-like flow and strong wet-out under pressure while maintaining material cohesion and processability after release.

Thermal Conductivity：9.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 40 with pseudo-plastic flow and clean handling
Material Type：ceramic-filled silicone pseudo-plastic structurally stable thermal pad
Core Advantage：Shows putty-like flow and strong wet-out under pressure while maintaining material cohesion and processability after release.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X8 is built around 9.0 W/m-K (Hot Disk) thermal performance together with Shore OO 40 with pseudo-plastic flow and clean handling. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Structurally Stable Putty-Like Technology
The proprietary structural matrix gives the highly filled material putty-like wet-out and gap-filling behavior under compression while preserving pad cohesion, liner release, and die-cut processability. It reduces the tearing or sticky handling often seen in ultra-soft high-conductivity materials.

Recommended Application Scenarios
VK-X8 is suitable for Networking and telecom, optical modules and transceivers, advanced packaging thermal interfaces, automotive electronics, and sensitive assemblies. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.