Performance Positioning and Thermal Value
VK-X7 is built around 8.0 W/m-K (Hot Disk) thermal performance together with Shore OO 50, balancing structural support and putty-like conformity. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Structurally Stable Putty-Like Technology
The proprietary structural matrix gives the highly filled material putty-like wet-out and gap-filling behavior under compression while preserving pad cohesion, liner release, and die-cut processability. It reduces the tearing or sticky handling often seen in ultra-soft high-conductivity materials.

Recommended Application Scenarios
VK-X7 is suitable for Industrial computing systems, aerospace avionics, networking equipment, high-reliability cooling modules, and high-density electronics. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.