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VK-X7N

Extremely Compressible 8W Clean Thermal Pad for Low-Stress Interfaces
VK-X7N is designed from the TDS specification for reliable thermal management. Reduces contact resistance under low-pressure assembly with high conformity while D3-D20 non-detectable chemistry lowers contamination risk in optical and automotive systems.

Thermal Conductivity：8.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 25, extremely high compression conformity
Material Type：ceramic-filled silicone clean-grade ultra-soft thermal pad
Core Advantage：Reduces contact resistance under low-pressure assembly with high conformity while D3-D20 non-detectable chemistry lowers contamination risk in optical and automotive systems.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X7N is built around 8.0 W/m-K (Hot Disk) thermal performance together with Shore OO 25, extremely high compression conformity. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Clean Material Platform and Reworkability
This series emphasizes D3-D20 non-detectable cleanliness and low volatile contamination risk while retaining the elastic recovery, natural tack, and reworkability of silicone pads. It suits products that demand higher long-term reliability and interface cleanliness.

Recommended Application Scenarios
VK-X7N is suitable for CPUs, GPUs, memory modules, ADAS control units, industrial power modules, optical transceivers, 5G base stations, and AI servers. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.