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VK-X602

Hybrid-Structure Thermal Pad for Low-Stress High-Performance Cooling
VK-X602 is designed from the TDS specification for reliable thermal management. Bridges elastic pads and putty-like materials, combining surface conformity, lower mechanical loading, and reliable handling.

Thermal Conductivity：7.0 W/m-K (Hot Disk); 10.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 40, low-stress with hybrid structural stability
Material Type：ceramic-filled silicone hybrid-structure thermal pad
Core Advantage：Bridges elastic pads and putty-like materials, combining surface conformity, lower mechanical loading, and reliable handling.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X602 is built around 7.0 W/m-K (Hot Disk); 10.0 W/m-K (ASTM D5470) thermal performance together with Shore OO 40, low-stress with hybrid structural stability. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Hybrid Structure and Lower Mechanical Loading
The hybrid structure combines the handling stability of an elastic pad with the interface wet-out of a putty-like material. It reduces assembly stress versus conventional harder pads under high filler loading, improving reliability in high-density systems.

Recommended Application Scenarios
VK-X602 is suitable for Power conversion, industrial electronics, GPU/CPU thermal management, SSDs, memory modules, aerospace avionics, and consumer electronics. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.