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VK-X6

6W Clean High-Performance Thermal Pad with Reworkability
VK-X6 is designed from the TDS specification for reliable thermal management. Combines high heat dissipation, rebound, and reusable assembly behavior on a D3-D20 non-detectable clean material platform.

Thermal Conductivity：6.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 40, soft with mechanical strength
Material Type：ceramic-filled silicone clean-grade high-performance thermal pad
Core Advantage：Combines high heat dissipation, rebound, and reusable assembly behavior on a D3-D20 non-detectable clean material platform.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X6 is built around 6.0 W/m-K (Hot Disk) thermal performance together with Shore OO 40, soft with mechanical strength. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Clean Material Platform and Reworkability
This series emphasizes D3-D20 non-detectable cleanliness and low volatile contamination risk while retaining the elastic recovery, natural tack, and reworkability of silicone pads. It suits products that demand higher long-term reliability and interface cleanliness.

Recommended Application Scenarios
VK-X6 is suitable for Notebook PCs, ultrabooks, networking equipment, power modules, LED controllers, ADAS ECUs, memory modules, and IC heat-spreading interfaces. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.