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VK-X5

High-Compliance 5W Thermal Pad for Low-Stress Heat Transfer
VK-X5 is designed from the TDS specification for reliable thermal management. Blankets uneven topographies and lowers contact resistance while helping protect BGAs, solder joints, and thin PCBs.

Thermal Conductivity：5.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 45, high compliance with low stress
Material Type：ceramic-filled silicone high-compliance thermal pad
Core Advantage：Blankets uneven topographies and lowers contact resistance while helping protect BGAs, solder joints, and thin PCBs.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X5 is built around 5.0 W/m-K (ASTM D5470) thermal performance together with Shore OO 45, high compliance with low stress. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Assembly-Friendly Mechanical Stability
The ceramic-filled silicone base provides reliable elastic recovery, surface wet-out, and handling strength. It maintains pad integrity during manual or automated placement and removes cleanly during service or rework to support production yield.

Recommended Application Scenarios
VK-X5 is suitable for Optoelectronics, medical devices, high-performance computing, automotive electronics, 5G telecom, advanced consumer electronics, power electronics, and industrial automation. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.