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VK-X403

4W Clean-Grade Thermal Pad with Soft Durable Handling
VK-X403 is designed from the TDS specification for reliable thermal management. Combines mid-level heat transfer, natural wet-out, high cohesive strength, and D3-D20 non-detectable cleanliness.

Thermal Conductivity：4.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 40, soft with high rebound and cohesive strength
Material Type：ceramic-filled silicone clean-grade thermal pad
Core Advantage：Combines mid-level heat transfer, natural wet-out, high cohesive strength, and D3-D20 non-detectable cleanliness.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X403 is built around 4.0 W/m-K (ASTM D5470) thermal performance together with Shore OO 40, soft with high rebound and cohesive strength. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Clean Material Platform and Reworkability
This series emphasizes D3-D20 non-detectable cleanliness and low volatile contamination risk while retaining the elastic recovery, natural tack, and reworkability of silicone pads. It suits products that demand higher long-term reliability and interface cleanliness.

Recommended Application Scenarios
VK-X403 is suitable for Notebook and desktop processors, 5G networking equipment, power modules, VRMs, communication base stations, industrial controls, and consumer electronics. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.