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VK-X3L

Standard All-Rounder 3W Thermal Pad for Reliable Cooling
VK-X3L is designed from the TDS specification for reliable thermal management. Balances heat transfer, compression, lateral strength, and reworkability as a versatile VK-series choice.

Thermal Conductivity：3.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 45, balanced elasticity, tensile strength, and wet-out
Material Type：ceramic-filled silicone general-purpose thermal pad
Core Advantage：Balances heat transfer, compression, lateral strength, and reworkability as a versatile VK-series choice.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X3L is built around 3.0 W/m-K (ASTM D5470) thermal performance together with Shore OO 45, balanced elasticity, tensile strength, and wet-out. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Assembly-Friendly Mechanical Stability
The ceramic-filled silicone base provides reliable elastic recovery, surface wet-out, and handling strength. It maintains pad integrity during manual or automated placement and removes cleanly during service or rework to support production yield.

Recommended Application Scenarios
VK-X3L is suitable for Power supplies, adapters, automotive electronics, routers, switches, modems, storage devices, and memory modules. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.