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VK-X3LS

Low-Stress High-Recovery Clean 3W Thermal Pad
VK-X3LS is designed from the TDS specification for reliable thermal management. Provides natural wet-out, high tensile strength, and reusable assembly behavior while meeting D3-D20 non-detectable cleanliness requirements.

Thermal Conductivity：3.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 35, low-stress with high elastic recovery
Material Type：ceramic-filled silicone clean-grade soft thermal pad
Core Advantage：Provides natural wet-out, high tensile strength, and reusable assembly behavior while meeting D3-D20 non-detectable cleanliness requirements.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X3LS is built around 3.0 W/m-K (ASTM D5470) thermal performance together with Shore OO 35, low-stress with high elastic recovery. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Clean Material Platform and Reworkability
This series emphasizes D3-D20 non-detectable cleanliness and low volatile contamination risk while retaining the elastic recovery, natural tack, and reworkability of silicone pads. It suits products that demand higher long-term reliability and interface cleanliness.

Recommended Application Scenarios
VK-X3LS is suitable for Network and 5G communication equipment, automotive electronics, industrial controls, power converters, notebook/desktop CPUs and GPUs, power ICs, and MOSFETs. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.