TW EN CN

Products

VK-A6US

Ultra-Soft Entry Pad for Large-Tolerance Low-Stress Interfaces
VK-A6US is designed from the TDS specification for reliable thermal management. Absorbs warpage and height variation with near-zero compression force to protect thin boards, solder joints, and fragile low-power ICs.

Thermal Conductivity：1.5 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 20, ultra-soft with very low compression force
Material Type：ceramic-filled ultra-soft silicone thermal pad
Core Advantage：Absorbs warpage and height variation with near-zero compression force to protect thin boards, solder joints, and fragile low-power ICs.

Download Documents
Detailed Introduction

Performance Positioning and Thermal Value
VK-A6US is built around 1.5 W/m-K (ASTM D5470) thermal performance together with Shore OO 20, ultra-soft with very low compression force. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Assembly-Friendly Mechanical Stability
The ceramic-filled silicone base provides reliable elastic recovery, surface wet-out, and handling strength. It maintains pad integrity during manual or automated placement and removes cleanly during service or rework to support production yield.

Recommended Application Scenarios
VK-A6US is suitable for Large-tolerance assemblies, fragile low-power ICs, cost-sensitive displays, basic LED lighting, and network or telecom equipment. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.