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SF-73

Soft Non-Silicone Thermal Interface for Reliable General Cooling
SF-73 is designed from the TDS specification for reliable thermal management. Improves contact across uneven interfaces with low stress while avoiding siloxane migration and outgassing contamination.

Thermal Conductivity：3.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 30, soft with reliable compression recovery
Material Type：ceramic-filled polyolefin elastomer non-silicone thermal pad
Core Advantage：Improves contact across uneven interfaces with low stress while avoiding siloxane migration and outgassing contamination.

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Detailed Introduction

Performance Positioning and Thermal Value
SF-73 is built around 3.0 W/m-K (Hot Disk) thermal performance together with Shore OO 30, soft with reliable compression recovery. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Non-Silicone Cleanliness and Low-Stress Design
The non-silicone elastomer formulation reduces low-molecular siloxane migration and outgassing risk, making it friendlier to optical, communication, and sensitive electronic systems. Its soft compressible structure conforms to height variation and surface roughness for stable interface contact.

Recommended Application Scenarios
SF-73 is suitable for Notebook computers, SSDs, memory modules, consumer electronics, power management devices, and general thermal interfaces. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.