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SF-74S

Ultra-Low-Stress Non-Silicone Pad for Delicate Electronics
SF-74S is designed from the TDS specification for reliable thermal management. Provides strong wet-out and cushioning under low assembly pressure for thermal management of thin and fragile components.

Thermal Conductivity：4.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 25, ultra-soft with very low compression stress
Material Type：ceramic-filled polyolefin elastomer non-silicone thermal pad
Core Advantage：Provides strong wet-out and cushioning under low assembly pressure for thermal management of thin and fragile components.

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Detailed Introduction

Performance Positioning and Thermal Value
SF-74S is built around 4.0 W/m-K (Hot Disk) thermal performance together with Shore OO 25, ultra-soft with very low compression stress. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Non-Silicone Cleanliness and Low-Stress Design
The non-silicone elastomer formulation reduces low-molecular siloxane migration and outgassing risk, making it friendlier to optical, communication, and sensitive electronic systems. Its soft compressible structure conforms to height variation and surface roughness for stable interface contact.

Recommended Application Scenarios
SF-74S is suitable for SSDs, memory devices, thin electronic assemblies, networking equipment, industrial electronics, and sensitive components. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.