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SF-76

High-Conductivity Non-Silicone Pad for Low-Stress Assembly
SF-76 is designed from the TDS specification for reliable thermal management. Combines 6.0 W/m-K heat transfer with soft compressibility to cover uneven interfaces while reducing component loading.

Thermal Conductivity：6.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 35, soft with high compression conformity
Material Type：ceramic-filled polyolefin elastomer non-silicone thermal pad
Core Advantage：Combines 6.0 W/m-K heat transfer with soft compressibility to cover uneven interfaces while reducing component loading.

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Detailed Introduction

Performance Positioning and Thermal Value
SF-76 is built around 6.0 W/m-K (Hot Disk) thermal performance together with Shore OO 35, soft with high compression conformity. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Non-Silicone Cleanliness and Low-Stress Design
The non-silicone elastomer formulation reduces low-molecular siloxane migration and outgassing risk, making it friendlier to optical, communication, and sensitive electronic systems. Its soft compressible structure conforms to height variation and surface roughness for stable interface contact.

Recommended Application Scenarios
SF-76 is suitable for GPU/CPU interfaces, AI and high-performance computing, networking equipment, optical modules, and industrial electronics. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.