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SF-79N

High-Reliability Non-Silicone Pad for High-Power Electronics
SF-79N is designed from the TDS specification for reliable thermal management. Balances high thermal conductivity, mechanical stability, and siloxane-free cleanliness for long-life systems.

Thermal Conductivity：9.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 55, balancing structural support and compression wet-out
Material Type：ceramic-filled polyolefin elastomer non-silicone thermal pad
Core Advantage：Balances high thermal conductivity, mechanical stability, and siloxane-free cleanliness for long-life systems.

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Detailed Introduction

Performance Positioning and Thermal Value
SF-79N is built around 9.0 W/m-K (Hot Disk) thermal performance together with Shore OO 55, balancing structural support and compression wet-out. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Non-Silicone Cleanliness and Low-Stress Design
The non-silicone elastomer formulation reduces low-molecular siloxane migration and outgassing risk, making it friendlier to optical, communication, and sensitive electronic systems. Its soft compressible structure conforms to height variation and surface roughness for stable interface contact.

Recommended Application Scenarios
SF-79N is suitable for GPU/CPU thermal management, AI servers, data centers, networking equipment, optical modules, automotive electronics, and industrial systems. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.