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SF-M

10W-Class Non-Silicone Thermal Pad for Clean High-Performance Cooling
SF-M is designed from the TDS specification for reliable thermal management. Offers a rare balance of high conductivity and mechanical compliance while reducing contamination risk in sensitive optical and high-speed systems.

Thermal Conductivity：10.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 45, soft with structural flexibility
Material Type：ceramic-filled polyolefin elastomer high-performance non-silicone thermal pad
Core Advantage：Offers a rare balance of high conductivity and mechanical compliance while reducing contamination risk in sensitive optical and high-speed systems.

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Detailed Introduction

Performance Positioning and Thermal Value
SF-M is built around 10.0 W/m-K (Hot Disk) thermal performance together with Shore OO 45, soft with structural flexibility. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Non-Silicone Cleanliness and Low-Stress Design
The non-silicone elastomer formulation reduces low-molecular siloxane migration and outgassing risk, making it friendlier to optical, communication, and sensitive electronic systems. Its soft compressible structure conforms to height variation and surface roughness for stable interface contact.

Recommended Application Scenarios
SF-M is suitable for AI accelerators, advanced computing, high-speed networking, 800G/1.6T optical modules, automotive camera and sensor modules, and precision industrial electronics. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.