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VK-XR1200

12W Upgraded Lightweight Thermal Gel for AI Cooling
VK-XR1200 is the upgraded part number from the VK-XR1020 platform after post-process improvement, increasing thermal performance to the 12.0 W/m-K class. It retains the dispensing convenience, low-stress gap filling, reworkability, and pump-out resistance of a pre-cured one-part thermal gel, making it suitable for high-power AI, data center, and advanced electronics thermal designs.

Thermal Conductivity：12.0 W/m-K class
Hardness / Compression：pre-cured one-part thermal gel with dispensability, reworkability, and pump-out resistance
Material Type：filled silicone high-performance lightweight thermal gel
Core Advantage：post-process improvement raises the VK-XR1020 platform to a 12W-class thermal performance while maintaining low density and vertical slump resistance.

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Detailed Introduction

Performance Upgrade and Thermal Value
VK-XR1200 is upgraded from the VK-XR1020 platform through post-process improvement, raising thermal performance to the 12.0 W/m-K class. Compared with the original 10.2W-class version, XR1200 provides greater thermal headroom within the same thermal gel application platform, helping high-power heat sources and cooling modules establish a more stable thermal path, lower interface resistance, and improve cooling efficiency.

Dispensing Process and Reliability Design
The pre-cured one-part design requires no mixing or secondary cure and supports automated dispensing, can packaging, or syringe supply. The gel flows into small voids under low pressure while holding shape, reducing pump-out, slump, and loading risk on fragile components; it also retains the XR1020 platform positioning of low density, reworkability, pump-out resistance, and vertical slump resistance for stable mass-production dispensing, interface conformity, and long-term reliability.

Recommended Application Scenarios
VK-XR1200 is suitable for AI training accelerators, hyperscale data center CPUs/GPUs, EV charging and power modules, aerospace avionics, high-end graphics cards, gaming consoles, and high-power networking equipment. Its material profile is especially useful for product designs requiring 12W-class thermal performance, dispensable processing, and reliable low-stress gap filling.