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VK-XR760

7.6W Process-Ready High-Performance Dispensable Thermal Gel
VK-XR760 is designed from the TDS specification for reliable thermal management. Uses Triple-Lock technology to lower D3-D20 risk while balancing flagship cooling, high-speed assembly, and multi-height gap filling.

Thermal Conductivity：7.6 W/m-K (ASTM D5470)
Hardness / Compression：pre-cured one-part thermal gel with about 20 g/min dispensing and low-pressure wet-out
Material Type：filled silicone high-performance dispensable thermal interface material
Core Advantage：Uses Triple-Lock technology to lower D3-D20 risk while balancing flagship cooling, high-speed assembly, and multi-height gap filling.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-XR760 is built around 7.6 W/m-K (ASTM D5470) thermal performance together with pre-cured one-part thermal gel with about 20 g/min dispensing and low-pressure wet-out. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Dispensing Process and Low-Stress Gap Filling
The pre-cured one-part design requires no mixing or secondary cure and supports automated dispensing, can packaging, or syringe supply. The gel flows into small voids under low pressure while holding shape, reducing pump-out, slump, and loading risk on fragile components.

Recommended Application Scenarios
VK-XR760 is suitable for Optical transceivers, fiber optic modules, ADAS sensors, handheld devices, 5G RRU/AAU, network ASICs, ECUs, motor controls, and power supplies. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.