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VK-XR530

5.3W Pre-Cured Thermal Gel Balancing Production and Cleanliness
VK-XR530 is designed from the TDS specification for reliable thermal management. Combines thixotropic balance, low BLT, anti-slump behavior, and pump-out resistance for large gaps and automated dispensing.

Thermal Conductivity：5.3 W/m-K (ASTM D5470)
Hardness / Compression：pre-cured one-part thermal gel with about 30 g/min dispensing and >3 mm gap stability
Material Type：pre-cured thermal conductive gel designed for low siloxane risk
Core Advantage：Combines thixotropic balance, low BLT, anti-slump behavior, and pump-out resistance for large gaps and automated dispensing.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-XR530 is built around 5.3 W/m-K (ASTM D5470) thermal performance together with pre-cured one-part thermal gel with about 30 g/min dispensing and >3 mm gap stability. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Dispensing Process and Low-Stress Gap Filling
The pre-cured one-part design requires no mixing or secondary cure and supports automated dispensing, can packaging, or syringe supply. The gel flows into small voids under low pressure while holding shape, reducing pump-out, slump, and loading risk on fragile components.

Recommended Application Scenarios
VK-XR530 is suitable for Optical and communication modules, large-gap assemblies, sensitive electronics, mass-production dispensing, and reworkable thermal structures. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.