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SS-2000

Graphite-over-Foam Thermal Gasket for Heat Spreading and Low-Force Compression
SS-2000 is designed from the TDS specification for reliable thermal management. Uses a high-conductivity graphite exterior for rapid in-plane spreading while the foam core absorbs tolerances and repeated insertion friction.

Thermal Conductivity：X-Y axis 1300-1500 W/m-K; Z axis 15-20 W/m-K
Hardness / Compression：silicone foam core with repeatable compression rebound and 180-degree bending resistance
Material Type：graphite film over PET, silicone foam core, and adhesive-backed thermal gasket
Core Advantage：Uses a high-conductivity graphite exterior for rapid in-plane spreading while the foam core absorbs tolerances and repeated insertion friction.

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Detailed Introduction

Performance Positioning and Thermal Value
SS-2000 is built around X-Y axis 1300-1500 W/m-K; Z axis 15-20 W/m-K thermal performance together with silicone foam core with repeatable compression rebound and 180-degree bending resistance. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Heat Spreading, Rebound, and Wear Resistance
The graphite exterior provides excellent in-plane heat spreading and a wear-resistant surface, while the foam core supplies low-force compression and repeatable rebound. The adhesive backing simplifies placement for strips, narrow widths, and pluggable module cooling.

Recommended Application Scenarios
SS-2000 is suitable for Pluggable transceivers, optical communication modules, notebooks, PCs, tablets, and thermal structures with sliding contact or repeated assembly. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.