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VK-X11S

11W Ultra-Soft Structurally Stable Putty-Like Pad for Extreme Cooling

VK-X11S is designed from the TDS specification for reliable thermal management. Uses a long-chain structural matrix to balance high filler loading, low compression stress, clean die-cutting, and D3-D20 non-detectable cleanliness.

Thermal Conductivity: 14.0 W/m-K (Hot Disk / ISO 22007-2)
Hardness: Shore OO 35, soft and low-stress with stable structure
Material Type: Ceramic-filled silicone high-conductivity structurally stable putty-like thermal pad
Core Advantage: Leads its class in performance while improving production convenience, interface conformity, and system service life.

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Detailed Introduction

Performance Positioning and Thermal Value:
VK-X11S is built around 11.0 W/m-K (Hot Disk / ISO 22007-2) thermal performance together with Shore OO 20, ultra-soft with structural cohesion. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Structurally Stable Putty-Like Technology:
The proprietary structural matrix gives the highly filled material putty-like wet-out and gap-filling behavior under compression while preserving pad cohesion, liner release, and die-cut processability. It reduces the tearing or sticky handling often seen in ultra-soft high-conductivity materials.
Recommended Applications: 
VK-X11S is suitable for Advanced AI packaging, optical modules and transceivers, networking equipment, high-density power devices, and sensitive electronic assemblies. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.