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VK-X7S

Flagship 8W Ultra-Soft Thermal Pad for Zero-Stress Compression
VK-X7S is designed from the TDS specification for reliable thermal management. Supports high filler loading with an advanced structural matrix, combining wet-out, tear resistance, and clean siloxane-free performance.

Thermal Conductivity：8.0 W/m-K (Hot Disk)
Hardness / Compression：Shore OO 15, extremely soft with zero-stress compression
Material Type：ceramic-filled silicone ultra-soft structural-matrix thermal pad
Core Advantage：Supports high filler loading with an advanced structural matrix, combining wet-out, tear resistance, and clean siloxane-free performance.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X7S is built around 8.0 W/m-K (Hot Disk) thermal performance together with Shore OO 15, extremely soft with zero-stress compression. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Structurally Stable Putty-Like Technology
The proprietary structural matrix gives the highly filled material putty-like wet-out and gap-filling behavior under compression while preserving pad cohesion, liner release, and die-cut processability. It reduces the tearing or sticky handling often seen in ultra-soft high-conductivity materials.

Recommended Application Scenarios
VK-X7S is suitable for Power electronics, aerospace avionics, high-power processors, BGAs, thin PCBs, optical/electrical contacts, and premium cooling modules. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.