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VK-X5US

Ultra-Soft 5W Thermal Pad for Sensitive High-Power Components
VK-X5US is designed from the TDS specification for reliable thermal management. Offers putty-like conformity with clean pre-formed pad handling for interfaces with large height variation and strict stress limits.

Thermal Conductivity：5.0 W/m-K (ASTM D5470)
Hardness / Compression：Shore OO 20, ultra-soft with near-zero compression force
Material Type：ceramic-filled ultra-soft silicone thermal pad
Core Advantage：Offers putty-like conformity with clean pre-formed pad handling for interfaces with large height variation and strict stress limits.

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Detailed Introduction

Performance Positioning and Thermal Value
VK-X5US is built around 5.0 W/m-K (HOT DISK) thermal performance together with Shore OO 20, ultra-soft with near-zero compression force. This design helps establish a stable thermal path between the heat source and heat sink, lowering interface resistance so high-density electronics can maintain more consistent cooling efficiency during long operation.

Assembly-Friendly Mechanical Stability
The ceramic-filled silicone base provides reliable elastic recovery, surface wet-out, and handling strength. It maintains pad integrity during manual or automated placement and removes cleanly during service or rework to support production yield.

Recommended Application Scenarios
VK-X5US is suitable for Fragile displays, medical equipment, bare-die ICs, multi-chip modules, thin PCBs, and automotive or aerospace low-stress cooling. Its material profile is especially useful for designs that need to balance heat transfer, assembly reliability, and long-term stability.